MediaTek and Samsung Achieve 3Tx 5-Layer Uplink Breakthrough, Setting New Benchmark for 5G Uplink Speed

HSINCHU, Taiwan – June 3, 2026 – MediaTek today announced a groundbreaking achievement in partnership with Samsung, successfully completing the industry’s first test of a 3Tx 5-layer uplink configuration. Harnessing MediaTek’s M90 5G modem platform and Samsung’s advanced network technology, including its virtualized RAN (vRAN), Massive-MIMO radios (MMU) and Macro radios, this joint demonstration establishes a new standard in 5G uplink performance.

Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66(1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering industry-leading speed and efficiency. The n66 band, operating with a 30 MHz bandwidth, and the n77 band, utilizing a total of 200MHz together achieved a remarkable total uplink throughput of 670 Mbps. Unlocking richer cloud and immersive experiences, this achievement strengthens FWA performance with significantly improved uplink peak speeds.

Pairing MediaTek’s latest 5G chipset platform with Samsung's networks solutions enables these significant gains by optimizing resource allocation, managing multiple frequency bands and serving multiple users simultaneously. Samsung’s fully software-based vRAN ensures flexibility and scalability, while radios provide robust coverage and capacity, minimizing interference and ensuring reliable connectivity. Additionally, MMUs enhance spectral efficiency by leveraging advanced MIMO technology to handle multiple data streams.

"This successful validation with Samsung represents a transformative milestone for the MediaTek 5G platform," said Dr. HC Hwang, General Manager of Wireless Communication Systems & Partnerships at MediaTek. "As the needs for ultra-high-resolution cloud applications continue to surge, this technology will be a key driver for next-generation industry innovation."

"By achieving another industry-first milestone in collaboration with MediaTek, Samsung continues to set the pace for enhanced uplink performance through advanced configurations," said Dongwoo Lee, Head of Technology Solution Group, Networks Business at Samsung Electronics. "This joint test demonstrates exceptional speeds that translate into unparalleled user experiences and reliable, constant connectivity. These gains have the potential to revolutionize industries and consumer usage alike."

The power of MediaTek’s 3Tx antenna technology and a 5-layer uplink architecture with Samsung Networks solutions validated dramatic spectral efficiency and transmission improvements. This smooth, low-latency performance will enable a more reliable and robust experience for data-intensive activities as our ever-connected world continues to evolve.

About MediaTek Inc.
MediaTek (TWSE: 2454) is a global leader in fabless semiconductor design, providing solutions from the edge to the cloud. Powering over 2 billion connected devices every year, MediaTek's leading-edge technology keeps the world connected and enhances everyday life. At the forefront of innovation, MediaTek drives advancements in transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8. Our high-performance, power-efficient products form the foundation for a smarter, more connected world, enabling devices from smartphones, smart homes and AI PCs to high-performance computing, automotive, and AI data centers. As a trusted partner to the world's leading brands, MediaTek leads the industry in creating solutions that meet the evolving needs of the global community, ensuring access to world-class technology for everyone. Our commitment to accelerating AI underscores our dedication to enriching the future of humanity. Visit http://www.mediatek.com for more information.